exemptions-art-4-restrictions-rohs

ROHS - Exemptions from Art. 4(1) Restrictions, Annexes III & IV

This database contains the application exemptions listed in Annexes III and IV to RoHS (2011/65/EU). Annex III contains applications exempted from the restriction in Article 4(1), while Annex IV lists applications exempted from the restriction in Article 4(1) specific to medical devices and monitoring and control instruments.

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Last updated 13 October 2020. Database contains 435 unique substances/entries.
Substance Name EC No. CAS No. Annex Reference Application Expiration Date  
231-100-4
7439-92-1
IV
39
In micro-channel plates (MCPs) used in equipment for medical devices and monitoring and control instruments
07/21/2021
Details
231-100-4
7439-92-1
IV
39
In micro-channel plates (MCPs) used in equipment for in-vitro diagnostic medical devices
07/21/2023
Details
231-100-4
7439-92-1
IV
39
In micro-channel plates (MCPs) used in equipment for industrial monitoring and control instruments
07/21/2024
Details
231-100-4
7439-92-1
IV
33
In solders on populated printed circuit boards used in Directive 93/42/EEC class IIb mobile medical devices other than portable emergency defibrillators
12/31/2020
Details
231-100-4
7439-92-1
IV
34
As an activator in the fluorescent powder of discharge lamps when used for extracorporeal photopheresis lamps containing BSP (BaSi2O5:Pb) phosphors
07/22/2021
Details
231-100-4
7439-92-1
IV
36
Used in other than C-press compliant pin connector systems for industrial monitoring and control instruments
12/31/2020
Details
231-100-4
7439-92-1
IV
32
In solders on printed circuit boards of detectors and data acquisition units for Positron Emission Tomographs which are integrated into Magnetic Resonance Imaging equipment
12/31/2019
Details
231-100-4
7439-92-1
III
7(c)-II
In dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
Details
231-100-4
7439-92-1
III
7(c)-III
In dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC
01/01/2013
Details
231-100-4
7439-92-1
III
7(c)-IV
In PZT based dielectric ceramic materials for capacitors which are part of integrated circuits or discrete semiconductors
07/21/2016
Details
231-100-4
7439-92-1
III
7(c)-I
Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound
07/21/2023
Details
231-100-4
7439-92-1
III
23
In finishes of fine pitch components other than connectors with a pitch of 0.65 mm and less
Details
231-100-4
7439-92-1
III
24
In solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors
07/21/2021
Details
231-100-4
7439-92-1
III
24
In solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors
07/21/2021
Details
231-100-4
7439-92-1
III
24
In solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors
07/21/2023
Details
231-100-4
7439-92-1
III
21
In printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses
Details
231-100-4
7439-92-1
III
16
In linear incandescent lamps with silicate coated tubes
09/01/2013
Details
231-100-4
7439-92-1
III
18(a)
As activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as speciality lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb)
01/01/2011
Details
231-100-4
7439-92-1
III
18(b)
As activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb)
Details
231-100-4
7439-92-1
III
19
With PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL)
06/01/2011
Details
231-100-4
7439-92-1
III
13(b)-(I)
In ion coloured optical filter glass types
07/21/2021
Details
231-100-4
7439-92-1
IV
11
In alloys as a superconductor and thermal conductor in MRI
Details
231-100-4
7439-92-1
IV
12
In metallic bonds creating superconducting magnetic circuits in MRI, SQUID, NMR (Nuclear Magnetic Resonance) or FTMS (Fourier Transform Mass Spectrometer) detectors
06/30/2021
Details
231-100-4
7439-92-1
IV
13
In counterweights
Details
231-100-4
7439-92-1
IV
6
Equipment utilising or detecting ionising radiation: In X-ray test objects
Details
231-100-4
7439-92-1
IV
1a
Sensors, detectors and electrodes: In ion selective electrodes including glass of pH electrodes
Details
231-100-4
7439-92-1
IV
1b
Sensors, detectors and electrodes: Anodes in electrochemical oxygen sensors
Details
231-100-4
7439-92-1
IV
1c
Sensors, detectors and electrodes: In infra-red light detectors
Details
231-100-4
7439-92-1
IV
27(a)
Solders which are used in magnetic fields within the sphere of 1 m radius around the isocentre of the magnet in medical magnetic resonance imaging equipment, including patient monitors designed to be used within this sphere
06/30/2020
Details
231-100-4
7439-92-1
IV
27(b)
Solders which are used in magnetic fields within 1 m distance from the external surfaces of cyclotron magnets, magnets for beam transport and beam direction control applied for particle therapy
06/30/2020
Details
231-100-4
7439-92-1
IV
27(a)
Termination coatings of electrical and electronic components and printed circuit boards which are used in magnetic fields within the sphere of 1 m radius around the isocentre of the magnet in medical magnetic resonance imaging equipment, including patient monitors designed to be used within this sphere
06/30/2020
Details
231-100-4
7439-92-1
IV
27(b)
Termination coatings of electrical and electronic components and printed circuit boards which are used in magnetic fields within 1 m distance from the external surfaces of cyclotron magnets, magnets for beam transport and beam direction control applied for particle therapy
06/30/2020
Details
231-100-4
7439-92-1
IV
26(b)
Termination coatings of electrical and electronic components and coatings of printed circuit boards which are used durably at a temperature below - 20 °C under normal operating and storage conditions
06/30/2021
Details
231-100-4
7439-92-1
IV
26(c)
Solders for connecting wires and cables which are used durably at a temperature below - 20 °C under normal operating and storage conditions
06/30/2021
Details
231-100-4
7439-92-1
IV
26(d)
Solders connecting transducers and sensors which are used durably at a temperature below - 20 °C under normal operating and storage conditions
06/30/2021
Details
231-100-4
7439-92-1
IV
26
Solders of electrical connections to temperature measurement sensors in devices which are designed to be used periodically at temperatures below - 150 °C
06/30/2021
Details
231-100-4
7439-92-1
IV
26(a)
Solders on printed circuit boards which are used durably at a temperature below - 20 °C under normal operating and storage conditions
06/30/2021
Details
231-100-4
7439-92-1
IV
23
As an alloying element for bearings and wear surfaces in medical equipment exposed to ionising radiation
06/30/2021
Details
231-100-4
7439-92-1
IV
24
Enabling vacuum tight connections between aluminium and steel in X-ray image intensifiers
12/31/2019
Details
231-100-4
7439-92-1
IV
25
In the surface coatings of pin connector systems requiring nonmagnetic connectors which are used durably at a temperature below - 20 °C under normal operating and storage conditions
06/30/2021
Details
231-100-4
7439-92-1
III
13(b)-(III)
In glazes used for reflectance standards
07/21/2021
Details
231-100-4
7439-92-1
III
13(b)
In filter glasses and glasses used for reflectance standards
07/21/2021
Details
231-100-4
7439-92-1
III
14
In solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight
01/01/2011
Details
231-100-4
7439-92-1
III
15
In solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
Details
231-100-4
7439-92-1
III
13(b)
In filter glasses and glasses used for reflectance standards
07/21/2024
Details
231-100-4
7439-92-1
IV
10
In atomic absorption spectroscopy lamps
Details
231-100-4
7439-92-1
IV
17
In solders in portable emergency defibrillators
Details
231-100-4
7439-92-1
IV
18
In solders of high performance infrared imaging modules to detect in the range 8-14 µm
Details
231-100-4
7439-92-1
IV
19
In Liquid crystal on silicon (LCoS) displays
Details
231-100-4
7439-92-1
IV
14
In single crystal piezoelectric materials for ultrasonic transducers
Details

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